MIKON Focused sessions
- Focused session 1
- Materials for Microwave Devices and Antennas
- Focused session 2
- Terahertz technologies, devices and systems
- Focused session 3
- Textile-integrated microwave components
- Focused session 4
- Europe’s first “Important Project of Common European Interest (IPCEI)” Innovative Technologies for Shaping the Future
„Materials for Microwave Devices and Antennas”
Focus area overview
The performance of microwave devices and antennas mainly depends on the properties of materials used in their design and implementation. Knowledge on material properties at microwave and higher frequencies is a prerequisite to select suitable materials for various microwave and antenna applications. The session will focus on advanced materials (including methods for their characterization and fabrication) with specific characteristics that allow obtaining new additional functionalities of devices/antennas, e.g. with extended tunability, with the possibility of fast switching, with the ability to absorb or reflect electromagnetic waves, with sensitivity to various gases, etc. All materials, such as magnetics, carbon-based materials, flexible or stretchable materials, biomaterials, phantoms, metamaterials, various composites, ceramics will be appreciated.
Session chair/organizer:
Yevhen Yashchyshyn, Professor, Ph.D, D.Sc.,
Head of Antennas and sub-THz research Group
Institute of Radioelectronics and
Multimedia Technology
Warsaw University of Technology, Warsaw, Poland
Artur Rydosz, Professor AGH, Ph.D, D.Sc.,
Integrated Labaoratory of Sensor Nanostructures
Department of Electronics
AGH University of Science and Technology, Krakow, Poland
„Terahertz Technologies, Devices and Systems”
Focus area overview
Terahertz technologies are rapidly developing and highly promising for many life and scientific activities. This session is devoted to various aspects of terahertz radiation from physics, through technologies, to devices and systems. It will be a convenient opportunity to learn about the latest research and hot topics in the field of terahertz radiation.
Session chair/organizer:
Col. Norbert Palka, Ph.D., D.Sc., Eng.
Head of the Security Systems Group
Institute of Optoelectronics, Military University of Technology
Kaliskiego 2 St., 00-908 Warsaw, POLAND
Pawel Kopyt, Ph.D., D.Sc., Eng.
Institute of Radioelectronics and Multimedia technology, Warsaw University of Technology
Nowowiejska 15/19, 00-665 Warsaw, POLAND
„Textile-integrated Microwave Components”
Focus area overview
The session is focused on the integration of microwave components (antennas, filters, transmission lines) to textile materials. Attention is particularly turned to three-dimensional knitted fabrics to be used as a textile equivalent of conventional Teflon-based substrates. Manufacturing technologies and their limitations are going to be discussed and application examples are going to be given.
Session chair/organizer:
Jaroslav Lacik
Dept. of Radio Electronics
Brno University of Technology
Czech Republic
Europe’s first “Important Project of Common European Interest (IPCEI)” Innovative Technologies for Shaping the Future
Background to IPCEI
In December 2018 the European Commission approved a project proposal of four EU member states – France, Germany, Italy and the UK – to start an “Important Project of Common European Interest (IPCEI)” on Microelectronics. It will allow the national governments to spend about €1.8 billion as public support to the project partners for innovative research and development, and investment in first industrial deployment. The project’s overall objective is to enable research and development of innovative technologies and advanced electronics components. Among them are semiconductor chip technologies, integrated circuits, sensors, assembly and packaging technologies as well as advanced equipment and materials. Target applications are consumer devices, for example home appliances and automated vehicles, commercial and industrial devices, such as the management systems for batteries used for electric mobility and energy storage. The integrated research and innovation project involves 27 direct participants. These direct participants will work in collaboration with a large number of partners, such as research organizations or small and medium-sized enterprises.
The IPCEI project is focusing on five technology fields, which are complementary and interlinked.
1. Energy efficient chips: Development of new solutions to improve the energy efficiency of chips. Besides others, they will reduce the overall energy consumption of electronic devices including those installed in cars.
2. Power semiconductors: Development of new technologies of components for smart appliances as well as for electric and hybrid vehicles, to increase the reliability of final semiconductor devices.
3. Smart sensors: Development of new optical, motion or magnetic field sensors with improved performance and enhanced accuracy. Besides others, such smart sensors will contribute to improve the traffic safety of cars by better adapting the overall traffic situation. Key will be to make sensor systems with shorter reaction time and increased reliability available.
4. Advanced optical equipment: Development of advanced technologies for future high-end chips.
5. Compound materials: Development of new compound materials (replacing silicon) and devices suitable for more advanced chips.
Millimeter-Wave Technologies in the “Important Project of Common European Interest (IPCEI)”and Related Projects – A Dedicated Session on Technology Field III Sensor Technologies
Abstract:
The IPCEI project’s overall objective is to enable research and development of innovative technologies and advanced electronics components with focus on strengthening development of production capabilities in Europe. During recent years, mm-wave technologies have shown impressive application potential e.g. for radar application. Recent package technology developments on fan-out wafer-level packaging (WLP) technologies push mm-wave application to mainstream applications. Focus of this special focus session at MIKON 2020 will be to present results from industrial research on mm-wave technologies and their application in the IPCEI. We will present results on two different SiGe semiconductor technologies investigated and developed by GlobalFoundries and Infineon, and we will introduce into assembly and package design including antenna integration. We will present results on chip-package-board-system co-design for supporting first time right technology runs. Focus will be to highlight a coherent chip-package-board-system approach. We will discuss potential mm-wave technologies and their technology capabilities. Finally we introduce in possible future applications like radar system for autonomous driving. Representatives of the major European microelectronics industry will give an insight into their R&D work and first results achieved to support development to set-up mm-wave fabrication capabilities of innovative products in Europe.
Session chair/organizer:
Klaus Pressel
Technology Development Coordination
Infineon Technologies AG
Regensburg, Germany
Maciej Wojnowski
Head RF Package Simulation & Characterization
Infineon Technologies AG
Munich, Germany